Local cover image
Microelectronics packaging handbook
Material type:
TextLanguage: English Publication details: Kluwer Academic publication 1997 BostobEdition: 2nd edSubject(s): DDC classification: - 621.381046Â N97 TUM R
| Item type | Current library | Collection | Call number | Vol info | Status | Barcode | |
|---|---|---|---|---|---|---|---|
Reference Books
|
Nalanda Library Reference | Reference | 621.381046 N97 TUM.R (Browse shelf(Opens below)) | Part-1: Technology drivers | Available | 8403 | |
|
Reference Books
|
Nalanda Library Reference | Reference | 621.381046 N97 TUM.R (Browse shelf(Opens below)) | Part-3: Semiconductor packaging | Available | 8405 | |
|
Reference Books
|
Nalanda Library Reference | Reference | 621.381046 N97 TUM.R (Browse shelf(Opens below)) | Part-3: Subsystem packaging | Available | 8404 |
Total holds: 0
Browsing Nalanda Library shelves, Shelving location: Reference, Collection: Reference Close shelf browser (Hides shelf browser)
| No cover image available | No cover image available | No cover image available | No cover image available |
|
|
|
||
| 621.381 T17 DAT Lessons from nanoelectronics : a new pepective on transport | 621.381046 N97 TUM.R Microelectronics packaging handbook | 621.381046 N97 TUM.R Microelectronics packaging handbook | 621.381046 N97 TUM.R Microelectronics packaging handbook | 621.3813 T09 COL Foundations for microwave engineering | 621.3813 T09 COL Foundations for microwave engineering | 621.3813 T09 RIZ Microwave engineering : passive circuits |
There are no comments on this title.
Log in to your account to post a comment.
Click on an image to view it in the image viewer