Tummala, Rao R. ...[et al.] <br/><br/>
Microelectronics packaging handbook: Subsystems packaging 

 - 2nd ed.. 
 -  Kluwer Academic publication  1997 
<br/><br/><label>ISBN: </label>9780412084515 
<br/><br/><label>Dewey Class. No.: </label>621.381046  / N97 TUM R